Nvidia may switch cooler solutions with the next generation of Ultra Rubin when fighting against thermal obstacles

Nvidia reportedly plans to switch to a completely new cooling solution for the next generation of Ultra AI Rubin, because it tries to reduce the increase in power needs and thermal problems.

Nvidia plans to switch to the microchannel cover plate with Rubin Ultra, squeezing the optimal performance level/watt

For those who are unconscious, having an adequate cooling solution for the next generation system is one of the top concerns for companies such as Nvidia, because the level of power withdrawal is greatly increased with every iteration, which requires adequate cooling mechanism on the ship. According to @qq_timmy, it is believed that Nvidia contacted the cooler solution partner to integrate the cooling of ‘direct-chip’ cooling through the microochannel cold plate for Rubin Ultra AI GPU, which can be proven to be a significant shift from conventional liquid cooling solutions and activating Nvidia to achieve top dance performance.

Let’s discuss the Microchannel Cover Plates (MCCP) mentioned here. This is somewhat similar to direct cooler, which is often used by overclocking fans with modern CPUs, and involves cold copper cold plates with micro channels embedded inside which allows the cooler to flow around. This allows plates to make local convection, reduce thermal resistance from dice to liquid. This is similar to the current conventional cooling solution for NVIDIA, except that changes are carried out directly to the liquid -cooled plate in the chip, allowing significant more efficient thermal management.

I can learn more about how MCCP works, but it is important to understand why Nvidia needs this technology. Team Green is in a very strict product rhythm, and increases from Blackwell to Rubin brings much higher power needs, especially in a complex rack scale system, which is why it is necessary for Nvidia to ‘think outside the box’. Even if the company does not want it, architectural progress forces them to invest in sophisticated cooling solutions.

It is said that Nvidia has contacted Asia Vital Components, a provider of Taiwan’s thermal solutions, to design MCCP for Rubin Ultra. However, it was originally planned for Rubin; The strict time line has provided an insufficient supplier of time to switch to advanced solutions. Interestingly, Microsoft recently announced the cooling of the microfluid, an approach similar to MCCP, with the main difference to be the focus on ‘Internal Cooling,’ where the cooler is located inside or in the back of the silicon itself. This shows that the industry clearly requires a new cooling option.

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